Chizhou Hisemi Electronic Technology Co., LTD was established in October 2014. Is a high-end electronic information manufacturing enterprise focusing on integrated circuit packaging and testing business, including integrated circuit packaging, wafer testing services, chip finished product testing services. In the field of packaging, it has core technologies such as MULTI-chip module (MCM) package, THREE-DIMENSIONAL (3D) stack package, miniaturized flat pin less (QFN/DFN) package, high-density micro-spacing integrated circuit package, etc. A number of independent core technologies have been formed in the testing field. The sizes of test wafers cover 12 “, 8 “, 6 “, 5 “, 4 “and other sizes, including 22nm, 28nm and above wafer manufacturing processes. In terms of chip testing, the company has developed more than 30 kinds of chip testing solutions, such as MCU chip, ADC chip, FPGA chip, GPU chip, video chip, RF chip, SoC chip and digital signal processing chip. The company’s independent research and development of 3D ribbon machine, fingerprint identification and sorting equipment, gravity testing and knitting machine and other equipment, has been mature use in the actual production practice. Products are widely used in 5G communications, automotive electronics, industrial control and consumer products, smart home, smart positioning, information security, fire safety, smart wear and other industries.

Company headquarters is located in chizhou anhui province, is China’s ecological economic demonstration zone, the golden waterway of the changjiang river in the north, 30 kilometers east to adjacent to the jiuhua mountain of the four famous buddhist mountains, domestic airports, high-speed, high-speed, convenient water transportation, convenient transportation, beautiful environment, set up research and development, manufacture in shenzhen, wuxi, hefei subsidiary, focus on customers in the service area.

Chizhou Hisemi electronics is a national high-tech enterprise, the Ministry of Industry and Information Technology special special new “little giant” enterprise, the construction of “postdoctoral research workstation” and “Anhui Province special chip system level packaging engineering research center”, “Anhui Province enterprise technology Center”, “Anhui Province industrial design Center” provincial technology platform. It has won the honor of “Technological Innovation Demonstration Enterprise of Anhui Province” and “Special new champion enterprise of Anhui Province”.