The 2023 China (Shenzhen) Integrated Circuit Summit (hereinafter referred to as the ICS2023 Summit) was successfully held at the JW Marriott Hotel in Baoan, Shenzhen from September 21 to 22, 2023. Chizhou Huayu Electronics appeared at the conference site and gave a keynote speech.
With the theme of “Insight into Core Trends, Building the Core Era Together”, the summit featured six thematic forums, focusing on six themes: RISC-V architecture and integrated circuit design, semiconductor manufacturing and advanced packaging, integrated development of the national “core fire” platform, data center chip application, SMIT EDA innovation ecological development and industry-education integration innovation and investment, to jointly discuss the breakthrough development path and opportunities of the integrated circuit industry.
As an exhibitor of the conference, Huayu Electronics appeared at booth 14 and accepted media interviews. In recent years, the company has been deeply engaged in semiconductors, continuously increased investment, actively promoted the process of product upgrading, and always adhered to the spirit of “quality-oriented and loyal to customers”, and gradually realized the progress from traditional packaging to advanced packaging. At present, the third phase of the company is intensively preparing for purification and decoration, and it is planned to be put into production in early 2024. At that time, Huayu Electronics will undertake more services and provide customers with one-stop packaging and testing solutions.
Hisemi Electronics Focusing on the field of packaging and testing, it has formed a packaging and testing industry chain with Huayu characteristics, providing customers with the best quality packaging and testing services.
