ESSOP

Product introduction
Abbreviation for Small Outline Package, one of the surface mount type packages, the pins are drawn from both sides of the Package in the shape of a seagull wing (L shape)

Product features
It is a common surface mount type packaging form. The pins lead out from both sides of the package in the shape of a seagull wing (L-shaped). The materials are plastic and ceramic. SOP is usually a patch package for 8 pin or more devices.

Application
Is one of the most mature industry packaging standards, often used in smart home, automotive electronics, industrial electronics, communication electronics, mobile phone electronics, Internet of Things, intelligent Internet of Things, voice remote control, microprocessor, LED display driver, lithium battery charging chip, high-performance motor drive IC, MCU, photovoltaic inverter and other products.

Process characteristics
Refer to or meet JEDEC standards
Customized design lead frame design and multi-specification pad size to meet different customer needs
Green manufacturing, lead-free process

Reliability test standard
The test criteria is zero defects in 77 sampling units
JEDEC Prerequisite: J-STD-20/JESD22-A113
Temperature/humidity test: 85°C/85% RH, JEDEC 22-A101
Temperature/humidity test: 85°C/85% RH, JEDEC 22-A101
Temperature cycle test: -65~150 ℃, JEDEC22-A104
High temperature storage test: 150°C, JEDEC 22-A103
High acceleration stress test: 130°C/85% rh /33.5 PSIA, JEDEC 22-A110/A118