FC-SOT23
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- FC-SOT23
Product Introduction
FC-SOT23 is a SOT23 packaging form that uses flip chip technology
Product Features
Based on the mature SOT23 packaging process, it has been improved and has good compatibility with existing surface mount technology (SMT) production lines. It can achieve production without large-scale equipment updates, reducing production costs and difficulties, and improving production efficiency.
The pin count and layout characteristics of SOT23 package, but FC-SOT23 can flexibly design the electrical functions of pins according to different chip functions and application requirements, such as power pins, ground pins, signal input and output pins, etc., to meet the requirements of various circuit topologies and find suitable application scenarios in different types of electronic devices.
application
Power amplifier, low-noise amplifier, switching regulator, audio amplifier, Bluetooth module, Wi Fi module, GPS navigation module, such as temperature sensor, pressure sensor, displacement sensor, etc.
process characteristics
flip chip technology
Using flip chip technology, the active area of the chip is facing the substrate, and the interconnection between the chip and the substrate is achieved through solder bumps arranged in an array on the chip. This method shortens the transmission distance of electrical signals, reduces adverse effects such as resistance and inductance, effectively improves the electrical performance of chips, and can meet the requirements of high-frequency and high-speed signal processing.
Reliable electrical connection
By achieving electrical connection between bumps and substrates, compared to traditional wire bonding, parasitic parameters caused by bonding wires are reduced, the stability and reliability of signal transmission are improved, and the risk of electromagnetic interference (EMI) is also reduced.
item | FCOL Model PKG |
---|---|
Electrical | Faster speed Lower impedance |
Heat Dissipation | Faster heat dissipation |
Reliability | High reliability |
I/O | More pins |
PKG Size | Smaller packaging size |
封装类型 Package Type | 封装外形 Package Model | 封装厚度 Package Height | 引脚间距 Lead Pitch | 框架尺寸 Lead Frame Size(mm) |
---|---|---|---|---|
FC-SOT23 | FC-SOT23-3L FC-SOT23-5L | 1.1 | 0.95 | 240*70(14R) 300*100(20R) |